Power Packages Interconnections for High Reliability Automotive ApplicationsMichele Calabretta, Angelo Messina, Marco Renna et al.|Unknown|2019Cited by 18
From Wafer Bifurcation to Warpage Die: a Correlation Method to determine the Warpage of a Metal-Coated Silicon SubstrateVincenzo Vinciguerra, Marco Renna, Giuseppe Luigi Malgioglio et al.|Unknown|2022Cited by 18
Investigating the Occurrence of Bifurcation in Large Metalized Wafers using ANSYS Layered Shell ElementsVincenzo Vinciguerra, Marco Renna, Mohamed Boutaleb et al.|Unknown|2023Cited by 11
Models of Bifurcation and Gravity Induced Deflection in Wide Band Gap 4H-SiC Semiconductor WafersVincenzo Vinciguerra, Marco Renna, Giuseppe Luigi Malgioglio et al.|Unknown|2023Cited by 8
Determination of the Equivalent Thickness of a Taiko Wafer Using ANSYS Finite Element AnalysisVincenzo Vinciguerra, Marco Renna, Giuseppe Luigi Malgioglio et al.|Applied Sciences|2023Cited by 6