Effect of arginine-based cleaning solution on BTA residue removal after Cu-CMPQi Wang, Baimei Tan, Siyu Tian et al.|Colloids and Surfaces A Physicochemical and Engineering Aspects|2019Cited by 57
Theoretical and electrochemical analysis on inhibition effect of benzotriazole and 1,2,4-triazole on cobalt surfaceDa Yin, Baimei Tan, Mengrui Liu et al.|Colloids and Surfaces A Physicochemical and Engineering Aspects|2020Cited by 51
Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnectionDa Yin, Mengrui Liu, Xiaoqin Sun et al.|Materials Chemistry and Physics|2020Cited by 47
Experimental validation and molecular dynamics simulation of removal of PO residue on Co surface by alkaline cleaning solution with different functional groupsXiaoqin Sun, Yazhen Wang, Da Yin et al.|Colloids and Surfaces A Physicochemical and Engineering Aspects|2020Cited by 41
Synergistic effect of LABSA/JFCE combined surfactant system on the removal of particles on copper wafer surfaceDa Yin, Baimei Tan, Siyu Tian et al.|Materials Chemistry and Physics|2020Cited by 29