Preliminary investigation on the implementation of an artificial synapse using TaOx-based memristor with thermally oxidized active layer
J. Kim(Dongguk University), Sungjun Kim(Dongguk University), Jung‐Kyu Lee(Dongguk University), Yongjin Park(Dongguk University)
Cited by 5
Related Papers
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
|IEEE Transactions on Components and Packaging Technologies|2003|223
Structural-relaxation-driven electron doping of amorphous oxide semiconductors by increasing the concentration of oxygen vacancies in shallow-donor states
|NPG Asia Materials|2016|64
Nanoscale enzyme reactors in mesoporous carbon for improved performance and lifetime of biosensors and biofuel cells
|Biosensors and Bioelectronics|2010|45
Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability
|Journal of Electronic Materials|2006|40