Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
Hyoung-Joon Kim(Korea Advanced Institute of Science and Technology), Yongjin Park(Dongguk University), J.T. Moon, Jin Lee(Samsung (South Korea)), Kwang-Won Koh, Joo Yeon Lee(Samsung (South Korea)), Jinhee Won, Kyung-Wook Paik(Korea Advanced Institute of Science and Technology), Sihyun Choe
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