Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability
Sangah Gam(Korea Advanced Institute of Science and Technology), Kyung‐Wook Paik(Korea Advanced Institute of Science and Technology), Hyoung-Joon Kim(Korea Advanced Institute of Science and Technology), Jong-Soo Cho, Yongjin Park(Dongguk University), Jeong‐Tak Moon
Cited by 40
Related Papers
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
|IEEE Transactions on Components and Packaging Technologies|2003|223
Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake
|Carbon|2016|79
Structural-relaxation-driven electron doping of amorphous oxide semiconductors by increasing the concentration of oxygen vacancies in shallow-donor states
|NPG Asia Materials|2016|64
Nanoscale enzyme reactors in mesoporous carbon for improved performance and lifetime of biosensors and biofuel cells
|Biosensors and Bioelectronics|2010|45