Thermomigration induced microstructure and property changes in Sn-58Bi solders

Yu-An Shen(The University of Osaka), Hiroshi Nishikawa(The University of Osaka), Shiqi Zhou(Tongji University), K. N. Tu, Jiahui Li(The University of Osaka)
Materials & Design
January 27, 2019
Cited by 58


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