500 °C high-temperature reliability of Ni/Nb ohmic contact on n-type 4H-SiC
Vuong Van Cuong(Hiroshima University), Shin-Ichiro Kuroki(Hiroshima University), Hiroshi Sezaki, Tadashi Sato(Hiroshima University), Seiji Ishikawa, Takamichi Miyazaki(Tohoku University), Tomonori Maeda, T. Meguro(Hiroshima University)
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