Fast, Clean and Low Damage Deprocessing Using Inductively Coupled and RIE Plasmas
William E. Vanderlinde(Cornell University), Addison R. Crockett, Christopher J. Von Benken(K Lab (United States)), C.M. Davin(Motorola (United States))
Proceedings - International Symposium for Testing and Failure Analysis
August 1, 1996
Cited by 4
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