Dopant, composition and carrier profiling for 3D structures
Wilfried Vandervorst(Imec the Netherlands), A. Budrevich(Intel (United States)), Umberto Celano(Arizona State University), Janusz Bogdanowicz(IMEC), Kristof Paredis(IMEC), Claudia Fleischmann(IMEC), Alexis Franquet(IMEC)
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