The impact of moisture in mold compound preforms on the warpage of PBGA packages
Cited by 6
Related Papers
Residual Stress Development in the Injection Molding of Polymers
|Polymer-Plastics Technology and Engineering|1984|114
Thermomechanical properties of 1C molding compounds
|Polymer Engineering and Science|1990|50
The impact of moisture in mold compound preforms on the warpage of PBGA packages
|Microelectronics Reliability|2003|29
Wire-Sweep Study Using an Industrial Semiconductor-Chip-Encapsulation Operation
|Journal of Electronic Packaging|1997|22
Stability of Flip-Chip Interconnects Assembled with Al/Ni(V)/Cu-UBM and Eutectic Pb-Sn Solder During Exposure to High-Temperature Storage
|Journal of Electronic Materials|2008|13