Effects of Pd addition on Au stud bumps/Al pads interfacial reactions and bond reliability
Hyoung-Joon Kim(Korea Advanced Institute of Science and Technology), Kyung‐Wook Paik(Korea Advanced Institute of Science and Technology), Jong-Soo Cho, Jin Lee(Samsung (South Korea)), Yongjin Park(Dongguk University)
Cited by 30
Related Papers
Effects of Cu/Al intermetallic compound (IMC) on copper wire and aluminum pad bondability
|IEEE Transactions on Components and Packaging Technologies|2003|223
Strength dependence of epoxy composites on the average filler size of non-oxidized graphene flake
|Carbon|2016|79
Structural-relaxation-driven electron doping of amorphous oxide semiconductors by increasing the concentration of oxygen vacancies in shallow-donor states
|NPG Asia Materials|2016|64
Nanoscale enzyme reactors in mesoporous carbon for improved performance and lifetime of biosensors and biofuel cells
|Biosensors and Bioelectronics|2010|45
Effects of Cu and Pd addition on Au bonding wire/Al pad interfacial reactions and bond reliability
|Journal of Electronic Materials|2006|40