Re-Examining The Physical Basis of Pattern Density and Step Height CMP ModelsXiaolin Xie, Duane S. Boning, Hong Cai et al.|MRS Proceedings|2003Cited by 10
Coherent Chip-Scale Modeling for Copper CMP Pattern DependenceHong Cai, Jeong‐Gun Lee, Tae Park et al.|MRS Proceedings|2004Cited by 8