Coherent Chip-Scale Modeling for Copper CMP Pattern Dependence
Hong Cai(Institute of Microelectronics), Jeong‐Gun Lee(SK Group (United States)), Hyungjun Kim(SK Group (United States)), Youngsoo Kang(SK Group (United States)), Tae Park(Massachusetts Institute of Technology), Sibum Kim(SK Group (United States)), Duane S. Boning(Massachusetts Institute of Technology)
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