S.G. Grubb

100-Gb/s dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are demonstrated. The transmitter is realized through the integration of over 50 discrete functions onto a single monolithic InP chip. The resultant DWDM PICs are capable of simultaneously transmitting and receiving ten wavelengths at 10 Gb/s on a DWDM wavelength grid. Optical system performance results across a representative DWDM long-haul link are presented for a next-generation optical transport system using these large-scale PICs. The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption.

The Letter reports what the authors believe to be the first single-wavelength pumped, CW, room-temperature, blue upconversion laser. This 480nm laser uses Tm3+ as the active ion in a fluorozirconate glass fibre. Up to 60 mW of output power has been observed with a slope efficiency of 18% with respect to coupled pump power.

In this paper we report the fabrication of a short, robust, single-mode Er/sup 3+/ fiber-grating laser. This laser is proven by the successful outcome of a long-term bit-error-rate test at the 10/sup -15/ level in a 5- G/s fiber transmission experiment. In the process we present a new pumping geometry, the elucidation of one origin of relaxation oscillations that have plagued previous lasers and the demonstration of a simple electronic feedback scheme for suppressing them. This prototype source shows real promise for use in a high-speed communications system.< <ETX xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">&gt;</ETX>

Contains fulltext : 92705.pdf (Publisher’s version ) (Open Access)

In this paper, the current state of the art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of highly integrated devices. Specifically, the performance, reliability, and manufacturability of commercial 100-Gb/s dense wavelength-division-multiplexed transmitter and receiver PICs are reviewed as well as next- and future-generation devices (500 Gb/s and beyond). The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which have enabled benefits at the component and system level.