Current Status of Large-Scale InP Photonic Integrated Circuits
Fred Kish(Infinera (United States)), David Welch(Infinera (United States)), R. Nagarajan(Infinera (United States)), J.L. Pleumeekers(Infinera (United States)), V. Lal(Infinera (United States)), M. Ziari(Infinera (United States)), A. Nilsson(Infinera (United States)), Masashi Kato(Infinera (United States)), S. Murthy(Infinera (United States)), Peter Evans(Infinera (United States)), S. Corzine(Infinera (United States)), Matthew Mitchell(Infinera (United States)), Parmijit Samra(Infinera (United States)), M. Missey(Infinera (United States)), S.D. DeMars(Infinera (United States)), Richard Schneider(Infinera (United States)), M. Reffle(Infinera (United States)), T. Butrie(Infinera (United States)), Jeff Rahn(Infinera (United States)), M. van Leeuwen(Infinera (United States)), J. Stewart(Infinera (United States)), Damien Lambert(Infinera (United States)), R. Muthiah(Infinera (United States)), H.S. Tsai(Infinera (United States)), J. Bostak(Infinera (United States)), A.G. Dentai(Infinera (United States)), Kuen‐Yuh Wu(Infinera (United States)), Han Sun(Infinera (United States)), D. Pavinski(Infinera (United States)), J. Zhang(Infinera (United States)), Jie Tang(Infinera (United States)), John McNicol(Infinera (United States)), M. Küntz(Infinera (United States)), Vince Dominic(Infinera (United States)), Brian D. Taylor(Infinera (United States)), R.A. Salvatore(Infinera (United States)), M. Fisher(Infinera (United States)), A. Spannagel(Infinera (United States)), E. Strzelecka(Infinera (United States)), P. Studenkov(Infinera (United States)), M. Raburn(Infinera (United States)), W. F. Williams(Infinera (United States)), D. Christini(Infinera (United States)), K. K. Thomson(Infinera (United States)), S.S. Agashe(Infinera (United States)), Roman Malendevich(Infinera (United States)), Gilad Goldfarb(Infinera (United States)), S. Melle(Infinera (United States)), C.H. Joyner(Infinera (United States)), Milton Kaufman(Infinera (United States)), S.G. Grubb(Infinera (United States))
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Abstract
In this paper, the current state of the art for large-scale InP photonic integrated circuits (PICs) is reviewed with a focus on the devices and technologies that are driving the commercial scaling of highly integrated devices. Specifically, the performance, reliability, and manufacturability of commercial 100-Gb/s dense wavelength-division-multiplexed transmitter and receiver PICs are reviewed as well as next- and future-generation devices (500 Gb/s and beyond). The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption which have enabled benefits at the component and system level.
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