Large-scale photonic integrated circuits
R. Nagarajan(Infinera (United States)), C.H. Joyner(Infinera (United States)), Richard Schneider(Infinera (United States)), J. Bostak(Infinera (United States)), T. Butrie(Infinera (United States)), A.G. Dentai(Infinera (United States)), Vince Dominic(Infinera (United States)), Peter Evans(Infinera (United States)), Masashi Kato(Infinera (United States)), Mike Kauffman(Infinera (United States)), Damien Lambert(Infinera (United States)), S.K. Mathis(Infinera (United States)), A. Mathur(Infinera (United States)), R. H. Miles(Infinera (United States)), Matthew Mitchell(Infinera (United States)), M. Missey(Infinera (United States)), S. Murthy(Infinera (United States)), A. Nilsson(Infinera (United States)), Frank H. Peters(Infinera (United States)), S.C. Pennypacker(Infinera (United States)), J.L. Pleumeekers(Infinera (United States)), R.A. Salvatore(Infinera (United States)), Rory Schlenker(Infinera (United States)), Robert B. Taylor(Infinera (United States)), Huan-Shang Tsai(Infinera (United States)), M.F. Van Leeuwen(Infinera (United States)), J. Webjörn(Infinera (United States)), M. Ziari(Infinera (United States)), D. Perkins(Infinera (United States)), Jagdeep Singh(Infinera (United States)), S.G. Grubb(Infinera (United States)), M. Reffle(Infinera (United States)), D. Mehuys(Infinera (United States)), Fred Kish(Infinera (United States)), David Welch(Infinera (United States))
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Abstract
100-Gb/s dense wavelength division multiplexed (DWDM) transmitter and receiver photonic integrated circuits (PICs) are demonstrated. The transmitter is realized through the integration of over 50 discrete functions onto a single monolithic InP chip. The resultant DWDM PICs are capable of simultaneously transmitting and receiving ten wavelengths at 10 Gb/s on a DWDM wavelength grid. Optical system performance results across a representative DWDM long-haul link are presented for a next-generation optical transport system using these large-scale PICs. The large-scale PIC enables significant reductions in cost, packaging complexity, size, fiber coupling, and power consumption.
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