Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal agingShiqi Zhou, Hiroshi Nishikawa, Muhammad Ghufran Rafique et al.|Journal of Alloys and Compounds|2018Cited by 89
Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technologyYu-An Shen, Hiroshi Nishikawa, Shiqi Zhou et al.|Materials & Design|2019Cited by 87
Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloyShiqi Zhou, Hiroshi Nishikawa, Chih-han Yang et al.|Materials Science and Engineering A|2018Cited by 70
Thermomigration induced microstructure and property changes in Sn-58Bi soldersYu-An Shen, Hiroshi Nishikawa, Shiqi Zhou et al.|Materials & Design|2019Cited by 58
The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strengthShiqi Zhou, Hiroshi Nishikawa, Chih-han Yang et al.|Materialia|2019Cited by 51