Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology
Yu-An Shen(The University of Osaka), Hiroshi Nishikawa(The University of Osaka), Shiqi Zhou(Tongji University), Shih‐kang Lin(National Cheng Kung University), Jiahui Li(The University of Osaka), Chih-han Yang(National Cheng Kung University), Sijie Huang(Tsinghua University)
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