Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked ICYudan Pi, Wei Wang, Yufeng Jin et al.|International Journal of Heat and Mass Transfer|2017Cited by 48
A fast and accurate temperature prediction method for microfluidic cooling with multiple distributed hotspotsYudan Pi, Wei Wang, Jing Chen et al.|International Journal of Heat and Mass Transfer|2018Cited by 24
Preliminary validation of entransy-based thermal management for 3D ICYudan Pi, Bing Cao, Han Sun et al.|Unknown|2013Cited by 3
Groove structure for stress releasing around TSVHan Sun, Yufeng Jin, Wei Wang et al.|Unknown|2013Cited by 3
Microfluidic Cooling for Distributed Hot-SpotsYudan Pi, Yufeng Jin, Wei Wang et al.|Unknown|2016Cited by 3