Preliminary validation of entransy-based thermal management for 3D IC

Yudan Pi(Peking University), Bing Cao(Tsinghua University), Jie Huang(Hong Kong University of Science and Technology), Han Sun(Shenzhen University), Wei Wang(Peking University), Jing Chen(Shanghai Jiao Tong University), Yufeng Jin(Peking University Shenzhen Hospital)
Unknown
August 1, 2013
10.1109/icept.2013.6756528
Cited by 3

Related Papers

Microalgae-Derived Pigments for the Food Industry
|Marine Drugs|2023|220
Discovery of Multitarget Inhibitors by Combining Molecular Docking with Common Pharmacophore Matching
|Journal of Medicinal Chemistry|2008|137
Pocket v.2:  Further Developments on Receptor-Based Pharmacophore Modeling
|Journal of Chemical Information and Modeling|2006|130
Thermal transport properties of GaN with biaxial strain and electron-phonon coupling
|Journal of Applied Physics|2020|102
The effect of voice cuing on releasing Chinese speech from informational masking
|Speech Communication|2007|78