Anisotropic equivalent thermal conductivity model for efficient and accurate full-chip-scale numerical simulation of 3D stacked IC
Yudan Pi(Peking University), Wei Wang(Peking University), Min Miao(Information Technology Institute), Jing Chen(Shanghai Jiao Tong University), Ningyu Wang(Peking University Shenzhen Hospital), Yufeng Jin(Peking University)
International Journal of Heat and Mass Transfer
December 17, 2017
Cited by 48
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