Investigation of Wet Pretreatment to Improve Cu-Cu Bonding for Hybrid Bonding ApplicationsTzu‐Heng Hung, Kuan‐Neng Chen, Ting-Cih Kang et al.|Unknown|2021Cited by 27
TSV Integration With Chip Level TSV-to-Pad Cu/SiO₂ Hybrid Bonding for DRAM Multiple Layer StackingTzu‐Heng Hung, Kuan‐Neng Chen, James Yi-Jen Lo et al.|IEEE Electron Device Letters|2023Cited by 21
Alternating PSM for sub-60-nm DRAM gate single exposureKunyuan Chen, Jengping Lin, ChungPing Hsia et al.|Proceedings of SPIE, the International Society for Optical Engineering/Proceedings of SPIE|2006Cited by 0