Review of THz-based semiconductor assuranceJohn True, Navid Asadizanjani, Chengjie Xi et al.|Optical Engineering|2021Cited by 52
Exploring Advanced Packaging Technologies for Reverse Engineering a System-in-Package (SiP)M Shafkat M Khan, Navid Asadizanjani, Chengjie Xi et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2023Cited by 34
Secure Interposer-Based Heterogeneous IntegrationM Shafkat M Khan, Navid Asadizanjani, Chengjie Xi et al.|IEEE Design and Test|2022Cited by 32
Machine Learning Assisted Counterfeit IC Detection through Non-destructive Infrared (IR) Spectroscopy Material CharacterizationChengjie Xi, Navid Asadizanjani, Aslam A. Khan et al.|2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)|2022Cited by 9
Physical Assurance for Heterogeneous Integration: Challenges and OpportunitiesChengjie Xi, Navid Asadizanjani, Nidish Vashisthan et al.|Unknown|2022Cited by 8