Exploring Advanced Packaging Technologies for Reverse Engineering a System-in-Package (SiP)
M Shafkat M Khan(Bangladesh University of Engineering and Technology), Navid Asadizanjani(University of Connecticut), Chengjie Xi(University of Florida), Md Saad Ul Haque(University of Florida), Mark Tehranipoor(University of Florida)
IEEE Transactions on Components Packaging and Manufacturing Technology
September 1, 2023
Cited by 34
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