W

W.W Lee

Texas Instruments (United States)

Publishes on Mechanical Behavior of Composites, Fatigue and fracture mechanics, Electronic Packaging and Soldering Technologies. 2 papers and 531 citations.

2Publications

531Total Citations

Mechanical Behavior of Composites Fatigue and fracture mechanics Electronic Packaging and Soldering Technologies Molecular Junctions and Nanostructures Force Microscopy Techniques and Applications

Is this you? Claim your profile.

Add your photo, update your bio, and get notified when your ranking changes.

Top publicationsby citations

Solder joint fatigue models: review and applicability to chip scale packages

W.W Lee, Luu Nguyen, Guna S Selvaduray|Microelectronics Reliability|2000

Cited by 506

Characterization and aluminum metallization of a parylene AF-4 surface

Ronald Sutcliffe, W.W Lee, Justin F. Gaynor et al.|Applied Surface Science|1998

Cited by 25