Solder joint fatigue models: review and applicability to chip scale packagesW.W Lee, Luu Nguyen, Guna S Selvaduray(San Jose State University)Microelectronics ReliabilityFebruary 1, 200010.1016/s0026-2714(99)00061-xCited by 506SaveCiteExport RISWatch citationsAbstractRelated PapersNo related papers foundPowered by citation graph analysis