Investigation of Photosensitive Polyimide With Low Coefficient of Thermal Expansion and Excellent Adhesion Strength for Advanced Packaging Applications
Yuan-Chiu Huang(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University), Y. R. Liu(National Yang Ming Chiao Tung University), Hui-Ching Hsieh(National Hsinchu University of Education)
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