Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging

Tianxiang Wu(Central South University), Junhui Li(University of Jinan), Wenya Tian(Central South University), Yunpeng Liu(Institute of High Energy Physics), Taotao Chen(China Electronics Technology Group Corporation), Long Dou(Central South University), Junfu Liu(China Electronics Technology Group Corporation), Zhong Jin(Central South University), Jinqing Xiao(Central South University)
IEEE Transactions on Components Packaging and Manufacturing Technology
April 18, 2022
10.1109/tcpmt.2022.3167734
Cited by 4

Related Papers

Development of multifunctional food packaging films based on chitosan, TiO2 nanoparticles and anthocyanin-rich black plum peel extract
|Food Hydrocolloids|2019|589
Morphable 3D mesostructures and microelectronic devices by multistable buckling mechanics
|Nature Materials|2018|398
Preparation and characterization of antioxidant, antimicrobial and pH-sensitive films based on chitosan, silver nanoparticles and purple corn extract
|Food Hydrocolloids|2019|342
Vertical full-colour micro-LEDs via 2D materials-based layer transfer
|Nature|2023|292
Spontaneous Formation of Asymmetric Oxygen Vacancies in Transition-Metal-Doped CeO<sub>2</sub> Nanorods with Improved Activity for Carbonyl Sulfide Hydrolysis
|ACS Catalysis|2020|289