Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic PackagingTianxiang Wu, Junhui Li, Junfu Liu et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2022Cited by 4
Research on the Mechanical Properties of Magnetorheological Damping and the Performance of Microprobe Test ProcessHuajie Huang, Junhui Li, Junjie Dai et al.|Journal of Electronic Testing|2022Cited by 0