Design and Fabrication of Leadless Package Structure for Pressure SensorsJunwang Tian, Junhui Li, Junfu Liu et al.|Journal of Electronic Packaging|2021Cited by 7
Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic PackagingTianxiang Wu, Junhui Li, Wenya Tian et al.|IEEE Transactions on Components Packaging and Manufacturing Technology|2022Cited by 4