Failure Strength Analysis and Young Modulus Assessment of 4H-SiC through a Ball on Ring Test
Vincenzo Vinciguerra(STMicroelectronics (Switzerland)), Angelo Messina(Innopolis University), Anna Bassi(STMicroelectronics (Italy)), Antonio Landi(STMicroelectronics (Italy)), Marco Renna(STMicroelectronics (Switzerland)), Alessandro Sitta(University of Catania), Michele Calabretta(STMicroelectronics (Italy)), Herbert Hintermaier(Disco (Germany)), Paolo Badalà(STMicroelectronics (Italy)), Gerald Klug(Disco (Germany))
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