Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Cheng-Ta Ko, S. W. Ricky Lee(University of Hong Kong), Rozalia Beica(Dow Chemical (United States)), Koh Sau Wee(Huawei Technologies (China)), Chieh-Lin Chang(Dow Chemical (United States)), Kai Wu(King University), Jhih-Yuan Pan(Dow Chemical (United States)), Eric Ng(ASM Pacific Technology (China)), Iris Xu, Curry Lin, Eric Kuah(ASM Pacific Technology (China)), Sze Pei Lim(Indium Corporation (United States)), Qing Xiang Yong(Huawei Technologies (China)), J. W. Lin, Kai-Ming Yang(Shenzhen University), Mian Tao(Hong Kong University of Science and Technology), Hsing-Hui Wu(Dow Chemical (United States)), Margie Li(ASM Pacific Technology (China)), Ming Li(Dalian University of Technology), Yuhua Chen(Stomatology Hospital), Zhang Li, Nelson Fan(ASM Pacific Technology (China)), Xi Cao(Central South University), Tony Chen(Hospital for Special Surgery), Marc Lin(Dow Chemical (United States)), N. C. Lee(Indium Corporation (United States)), Yiu-Ming Cheung(ASM Pacific Technology (China)), K. H. Tan, Zhong Cheng(Huawei Technologies (China)), John H. Lau(ASM Pacific Technology (China)), Ji Hao(ASM Pacific Technology (China)), Jeffery C. C. Lo(Hong Kong University of Science and Technology)
IEEE Transactions on Components Packaging and Manufacturing Technology
July 12, 2018
Cited by 49
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