Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging With Large Chips and Multiple Redistributed Layers
John H. Lau(ASM Pacific Technology (China)), Xi Cao(Central South University), Rozalia Beica(Dow Chemical (United States)), Kai Wu(King University), Iris Xu, Lei Yang(Xi'an Jiaotong University), Eric Kuah(ASM Pacific Technology (China)), Sze Pei Lim(Indium Corporation (United States)), Qing Xiang Yong(Huawei Technologies (China)), Sandy Chen, Winsons Bao, Margie Li(ASM Pacific Technology (China)), Ming Li(Dalian University of Technology), Zhang Li, Nelson Fan(ASM Pacific Technology (China)), Tony Chen(Hospital for Special Surgery), Cheng-Ta Ko, K. H. Tan, Janardhanan Pillai Madhukumar(ASM Pacific Technology (China))
IEEE Transactions on Components Packaging and Manufacturing Technology
July 11, 2018
Cited by 51
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