Heat transfer study of submicro-encapsulated PCM plate for food packaging application
Hong‐Minh Hoang, G. Álvarez, Eleni Gogou(National Technical University of Athens), Petros Taoukis(National Technical University of Athens), Denis Leducq, Rocío Pérez-Masiá(Instituto de Agroquímica y Tecnología de Alimentos), José M. Lagarón(Consejo Superior de Investigaciones Científicas)
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