Determination of the eutectic structure in the Ag-Cu-Sn systemDaniel Lewis, Adam M. Scotch, S.L. Allen et al.|Journal of Electronic Materials|2002Cited by 88
Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-AgS.L. Allen, Robert Schaefer, Daniel Lewis et al.|Journal of materials research/Pratt's guide to venture capital sources|2004Cited by 64
Phase equilibria and thermal analysis near the Au-Pb-Sn ternary eutecticDaniel Lewis, Angela Grusd, Michael R. Notis|Journal of Phase Equilibria and Diffusion|2000Cited by 2
Diffusion of <sup>110m</sup>Ag Tracer in Polycrystalline Piezoelectric CeramicsDaniel Lewis, Yoshihiko Imanaka, Michael R. Notis et al.|Defect and diffusion forum/Diffusion and defect data, solid state data. Part A, Defect and diffusion forum|2001Cited by 0