Microstructural evolution in lead-free solder alloys: Part II. Directionally solidified Sn-Ag-Cu, Sn-Cu and Sn-AgS.L. Allen, Robert Schaefer, Daniel Lewis et al.|Journal of materials research/Pratt's guide to venture capital sources|2004Cited by 64
Directional solidification in a AgCuSn eutectic alloyRobert Schaefer, Daniel Lewis|Metallurgical and Materials Transactions A|2005Cited by 26