Warpage and Thermal Characterization of Fan-Out Wafer-Level Packaging
John H. Lau(ASM Pacific Technology (China)), Xi Cao(Central South University), Koh Sau Wee(Huawei Technologies (China)), Ning Cheng Lee(Indium Corporation (United States)), Kai Wu(King University), Ken Cheung(ASM Pacific Technology (China)), Eric Kuah(ASM Pacific Technology (China)), Sze Pei Lim(Indium Corporation (United States)), Dewen Tian(ASM Pacific Technology (China)), Margie Li(ASM Pacific Technology (China)), Ming Li(Intelligent Health (United Kingdom)), Yuhua Chen(Micron Corporation (United States)), Zhang Li(Shanghai University of Medicine and Health Sciences), Nelson Fan(ASM Pacific Technology (China)), Cheng-Ta Ko, K. H. Tan, J Y Hao(ASM Pacific Technology (China)), Rozalia Beica(Dow Chemical (United States))
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