Genome sequence of the date palm Phoenix dactylifera LDate palm (Phoenix dactylifera L.) is a cultivated woody plant species with agricultural and economic importance. Here we report a genome assembly for an elite variety (Khalas), which is 605.4 Mb in size and covers >90% of the genome (~671 Mb) and >96% of its genes (~41,660 genes). Genomic sequence analysis demonstrates that P. dactylifera experienced a clear genome-wide duplication after either ancient whole genome duplications or massive segmental duplications. Genetic diversity analysis indicates that its stress resistance and sugar metabolism-related genes tend to be enriched in the chromosomal regions where the density of single-nucleotide polymorphisms is relatively low. Using transcriptomic data, we also illustrate the date palm’s unique sugar metabolism that underlies fruit development and ripening. Our large-scale genomic and transcriptomic data pave the way for further genomic studies not only on P. dactylifera but also other Arecaceae plants. The date palm is one of the most economically important plants of the palm family. Here, the authors present a high-quality genome assembly of the date palm Phoenix dactylifera, and reveal insights into the unique sugar metabolism underlying fruit ripening.
Wafer‐Scale Micro‐LEDs Transferred onto an Adhesive Film for Planar and Flexible DisplaysZhangxu Pan, Chan Guo, Xianchi Wang et al.|Advanced Materials Technologies|2020 Abstract The development of micro‐sized light emitting diode (LED) displays has driven the research of micro‐LED mass‐transfer technology. To date, various transfer technologies are proposed, but ample room for improvements in the transfer yield and transfer accuracy still remains. Furthermore, whether these techniques are suited for the subsequent bonding process is not well investigated, which is essential for achieving a good electric connection between micro‐LEDs and driver electronics. Here a systematical solution, termed as “tape‐assisted laser transfer,” which is not only suited for high‐yield micro‐LED transfer but also well compatible with subsequent bonding process, is developed. Using a low‐cost adhesive tape as the support substrate, the method allows fast and wafer‐level transfer of micro‐LED with extremely high yield (≈99.8%) and minimized transfer displacement (<0.5 µm), based on a laser lift‐off (LLO) process. Combined with a shadow mask, the LLO process also allows the selective transfer of micro‐LED to the tape. Such thin film micro‐LEDs are well compatible with the subsequent “bumpless” bonding process using low‐melting point solder. Representative display devices including planar display and deformable display are further developed, suggesting the method has a good potential for developing high‐resolution micro‐LED display panels for the applications in VR/AR, wearables, and smart glasses.