Advances and Future Challenges in Monolithic 3D Integrated Logic, Power, and Optoelectronics Technologies for Tightly Interconnected Intelligent Systems
Haksoon Jung(Ulsan National Institute of Science and Technology), Young Joon Hong(Sungkyunkwan University), Hanggyo Jung(The University of Texas at Dallas), Young Jae Song(Sungkyunkwan University), Heechun Park(Ulsan National Institute of Science and Technology), Bong Gyu Shin(Institute of Nanotechnology), Hoon Hahn Yoon(Gwangju Institute of Science and Technology), Byung‐Sung Kim(Sungkyunkwan University), Yeonjoo Lee(Los Alamos National Laboratory), W. Yang(Sungkyunkwan University), Sungjoo Lee(Tohoku University), Kibum Kang(Korea Advanced Institute of Science and Technology), Jaehyun Lee(Korea Advanced Institute of Science and Technology), Changsoo Kim(Institute of Nanotechnology), J. W. Bae(Sungkyunkwan University), Hyungwoo Kim(Blue Cross and Blue Shield of Kansas City), Jae-Hoon Han(Korea Institute of Science and Technology), Sang Hyeon Kim(Korea Advanced Institute of Science and Technology), J.J. Kim(Sungkyunkwan University), Jiwook Kwon(Samsung (South Korea)), Jimin Kwon(Samsung (South Korea)), Jongwook Jeon(Sungkyunkwan University), Gyumin Kim(Ulsan National Institute of Science and Technology), Seunghun Baek(Ulsan National Institute of Science and Technology), Hyung-Jun Kim(Blue Cross and Blue Shield of Kansas City), Joonghoon Choi(Sejong University), Jaeyong Jeong(Korea Advanced Institute of Science and Technology), Jinkyoung Yoo(Los Alamos National Laboratory)
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