Integrated 3D-printed multilayer FSS with high interlayer reliability for multi-band radomes
Hongbo Lan(Qingdao University), Tianwen Wang(China South Industries Group (China)), Wenzheng Sun(Ministry of Education of the People's Republic of China), Houchao Zhang(Qingdao University), Xing Liu(Kunming University of Science and Technology), Rui Wang(Qingdao University of Technology), Xiaoyang Zhu(Qingdao University), Juchen Li(Qingdao University), Zhenghao Li(Qingdao University), Hongke Li(Qingdao University of Science and Technology)
Cited by 2
Related Papers
Firms' digitalization in manufacturing and the structure and direction of green innovation
|Journal of Environmental Management|2023|306
Directly Printed Embedded Metal Mesh for Flexible Transparent Electrode via Liquid Substrate Electric‐Field‐Driven Jet
|Advanced Science|2022|192
Templateless, Plating‐Free Fabrication of Flexible Transparent Electrodes with Embedded Silver Mesh by Electric‐Field‐Driven Microscale 3D Printing and Hybrid Hot Embossing
|Advanced Materials|2021|185