Templateless, Plating‐Free Fabrication of Flexible Transparent Electrodes with Embedded Silver Mesh by Electric‐Field‐Driven Microscale 3D Printing and Hybrid Hot Embossing
Xiaoyang Zhu(Qingdao University of Science and Technology), Hongbo Lan(Qingdao University of Technology), Jiankang He(Xi'an Jiaotong University), Lei Qian(Hong Kong Polytechnic University), Dichen Li(Xi'an Jiaotong University), Yuan‐Fang Zhang(South China University of Technology), Nairui Gou(Qingdao University of Technology), Mingyang Liu(Southwest University of Science and Technology), Zhenghao Li(Qingdao University of Science and Technology), Jianjun Yang(Qingdao University of Technology), Quan Xu(Qingdao University of Technology), Zilong Peng(Qingdao University of Technology), Hongke Li(Qingdao University of Science and Technology), Ximeng Qi(Qingdao University of Technology)
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