Transient Thermal Characterization and Assessment of Power Module With Encapsulated Phase Change Material Toward Overload Capability
Yuxi Liang(Chongqing University), Li Ran(Durham University), Senhao Liang(Chongqing University), Yiming Gong(Chongqing University), Jiakun Gong(Chongqing University), Zheng Zeng(Chongqing University), Huayang Zheng(Chongqing University), Peng Sun(Chongqing University)
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