Study on Microstructure and Joint Strength of Sn-0.7Cu-0.8Zn/Cu Solder Joints by Bi Addition Modification
Wenbin Tu(Nanchang Hangkong University), Jilin Xie(Nanchang Hangkong University), Mingwei Wei(Nanchang Hangkong University), Hanbing Wang(First People's Hospital of Foshan), Shanlin Wang(Dalian University of Technology), Yuhua Chen(Stomatology Hospital), Timing Zhang(Nanchang Hangkong University)
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