The Advantages of Low temperature (<400°C) Carbon Nano-Tubes (CNTs) as Through Silicon Vias (TSVs) in Multi-Layer Stacking and Backside Power-Via Application

Nilabh Basu(National Taiwan University of Science and Technology), Ming-Han Liao(National Chung Hsing University), Yi-Cheng Chan(National Taiwan University), Yi‐Ting Tsai(National Yang Ming Chiao Tung University), Hongyi Lin(National Taiwan University), Ting-Wei Chen(Sichuan Agricultural University), Yu-Cheng Lin(National Taiwan University), P. A. Lin(National Taiwan University), Tung-Han Wu(National Taiwan University), Hong-Cheng Guo(National Taiwan University)
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