Wrap-like transfer printing for three-dimensional curvy electronics
X. Chen(Ministry of Industry and Information Technology), Xue Feng(Tsinghua University), Yinji Ma(Tsinghua University), Yu Kang(Ministry of Industry and Information Technology), Zhijian Wang(Ministry of Industry and Information Technology), Pengcheng Sun(State Key Laboratory of New Ceramics and Fine Processing), Jun Ai(Hebei Medical University), Wei Jian(Tsinghua University), Zhouheng Wang(Ministry of Industry and Information Technology), Heling Wang(Northwestern University), Ying Chen(Ministry of Industry and Information Technology)
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