Atomic-level flatness on oxygen-free copper surface in lapping and chemical mechanical polishing
Dongdong Liu(Dalian Institute of Chemical Physics), Wei Liu(Guangdong University of Technology), Zhibin Yu(Ocean University of China), Jiajian Feng(Dalian University of Technology), Zhenyu Zhang(China University of Petroleum, East China), Guanghong Xu(Dalian University of Technology), Fanning Meng(Dalian University of Technology), Jianmei Wang(Taiyuan University of Science and Technology), Wei Wen(Beijing Technology and Business University)
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