Security challenges of MEMS devices in HI packaging

Aslam A. Khan(University of Florida), Navid Asadizanjani(University of Florida), Chengjie Xi(University of Florida), Keon Sahebkar(University of Florida), Ryan F. Need(University of Florida), Mark Tehranipoor(University of Florida)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
May 1, 2022
Cited by 5


Related Papers