Circuit‐Level Memory Technologies and Applications based on 2D Materials

Jiahui Ma(University of Southern California), Han Wang(IBM Research - Thomas J. Watson Research Center), Ning Yang(Chinese Academy of Medical Sciences & Peking Union Medical College), Jing Guo(University of Science and Technology of China), Yuhao Zhang(Jiangsu Normal University), Xu Zhang(California State University, Northridge), Sen Lin(Fuzhou University), Jingyi Zou(Carnegie Mellon University), Hefei Liu(University of Southern California)
Advanced Materials
May 24, 2022
Cited by 49


Related Papers