Cost Effective 2.3D Packaging Solution by using Fanout Panel Level RDL
Joonsung Kim(Samsung (South Korea)), Dongwook Kim(Chonnam National University), Sanguk Kim(Pohang University of Science and Technology), Seok Won Lee(Samsung (South Korea)), Jaehoon Choi(Samsung (South Korea)), Sangyu Kim(Samsung (South Korea)), Tae-Je Cho(Samsung (South Korea)), Sang-Wook Park(Samsung (South Korea)), Yongjin Park(Dongguk University), Gyoungbum Kim(Samsung (South Korea)), Joo-Young Choi(Samsung (South Korea)), Hwasub Oh(Samsung (South Korea))
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