Ultra-High Strength Cu-Cu Bonding under Low Thermal Budget for Chiplet Heterogeneous Applications
Zhong-Jie Hong(National Yang Ming Chiao Tung University), Kuan‐Neng Chen(National Yang Ming Chiao Tung University), Hanwen Hu(North Sichuan Medical University), M. C. Lin(National Yang Ming Chiao Tung University), Tsau‐Hua Hsieh(National Yang Ming Chiao Tung University), Demin Liu(National Yang Ming Chiao Tung University)
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